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Deposition

Deposition services can be requested through our ‘Build Your Own Coating’ page or with a simple Request for Quotation form. Gold and silver coated substrates are available in the Online Store.

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DC/RF Sputtering

  • Three source magnetron sputtering system capable of producing multilayer films without ever having to break UHV.
  • RF sputtering (13.56 MHz) is available for depositing highly insulating materials.
  • Substrate rotation ensures high deposition uniformity.
  • Typical substrate sizes are 2”, 3”, and 4” diameters, however custom sizes and shapes can also be accommodated.
  • Please inquire about substrate heating/cooling.

 

Electron Beam Evaporation

  • Four pocket, 15 cc electron beam source capable of producing multilayer films without ever having to break UHV.
  • Substrate rotation ensures high deposition uniformity.
  • Typical substrate sizes are 2”, 3”, and 4” diameters, however custom sizes and shapes can also be accommodated.
  • Please inquire about substrate heating/cooling.

 

Plasma Enhanced Chemical Vapor Deposition

  • We typically employ the PECVD system to coat 4” diameter silicon wafers with silicon dioxide, silicon nitride, and silicon oxynitride.
  • Please inquire about CVD of other materials.

 

Electroplating

  • We typically use the electroplating bench to deposit copper onto 4” diameter silicon wafers.
  • Please inquire about electroplating of other materials.

 

Osmium Plasma Coating

  • Coats non-conductive samples prior to scanning electron microscopy imaging.
  • Amorphous osmium coating prevents charge build-up and prevents damage to delicate samples from the electron beam.

 

Common Deposition Materials:

Oxides (CuO, ITO, SiO2, TiO2, ZnO)
Metals (Al, Ag, Au, Ca, Co, Cr, Cu, Fe, In, Mg, Mn, Mo, Ni, Pt, Pd, Ti, W, Zn)
Semiconductors (BN, CdS, CdTe, Ge, Si, Si3N4, Silicon Oxynitride)

Can’t find the material you’re looking for?

Contact us and our experts will be happy to assess feasibility and provide rapid quotation.