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Other Deposition Services

Plasma Enhanced Chemical Vapor Deposition

  • We typically employ the PECVD system to coat 4” diameter silicon wafers with silicon dioxide, silicon nitride, and silicon oxynitride.
  • Please inquire about CVD of other materials.

 

Electroplating

  • We typically use the electroplating bench to deposit copper onto 4” diameter silicon wafers.
  • Please inquire about electroplating of other materials.

 

Osmium Plasma Coating

  • Coats non-conductive samples prior to scanning electron microscopy imaging.
  • Amorphous osmium coating prevents charge build-up and prevents damage to delicate samples from the electron beam.

 

Deposition services can be requested through our ‘Build Your Own Coating’ page or with a simple Request for Quotation form. Gold and silver coated substrates are available in the Online Store.